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Tech
In the dynamic realm of ATE interface hardware, our focus lies a commitment to continuous evolution in design, coupled with strategic collaborations with industry-leading upstream partners. This synergistic approach not only ensures the seamless integration of innovative technologies into our products but also positions us at the forefront of the ever-evolving tech landscape, driving us to deliver solutions that not only meet but exceed the demands of a rapidly advancing industry.
May 07
2026
Case Study 1: Mastering Chiplet Probing: 120+ Site Parallel Testing
Discover how our 50-layer PCB and 120-site vertical probe card solution solves challenges in HPC & AI Chiplet testing on the Teradyne UF+ platform.
Apr 07
2026
5 Common Errors in Semiconductor Burn-in Board Design and How to Avoid Them
Five common errors in burn-in board design: material fatigue, insufficient PDN impedance, signal trace length matching, socket selection, and maintainability. Practical avoidance methods are provided to enhance BIB reliability and lifespan.
Mar 26
2026
2026 Advanced Packaging Test Trends: How CPO, HBM4, and Glass Substrates Reshape ATE Interface Hardware Semiroc
With advanced packaging market reaching $47.88B in 2026, CPO, HBM4 16-Hi stacking, and glass substrates drive custom ATE test interfaces. Learn about optoelectronic hybrid test, ultra-fine pitch probe cards, and liquid-cooled test solutions.
Mar 23
2026
ATE Load Board Selection Guide 2026 | Pin Count to Reliability
How to select the right ATE Load Board for Teradyne UltraFLEX, Advantest V93000? Learn about pin count, signal integrity, power integrity, thermal management, and supplier evaluation. Achieve a higher first-pass yield.
Nov 23
2023
A Quantum Leap in Manufacturing: Our Strategic Partner Achieves Breakthroughs in MLO(multi-layer-organics) Capabilities
According to the official WeChat account of Western Chongqing Science City, recently, the IDM industry base project of Oson Semiconductor's 8-inch MEMS characteristic chip has settled in the Western (Chongqing) Science City, with Guangzhou Oson Electronics Co., Ltd. as the investment entity.
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