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Tech
In the dynamic realm of ATE interface hardware, our focus lies a commitment to continuous evolution in design, coupled with strategic collaborations with industry-leading upstream partners. This synergistic approach not only ensures the seamless integration of innovative technologies into our products but also positions us at the forefront of the ever-evolving tech landscape, driving us to deliver solutions that not only meet but exceed the demands of a rapidly advancing industry.
Aug 03
2026
Case Study 5: Layer Efficiency and Mechanical Reliability for High Site-Count MAP Test
Mobile SoC volume testing is pushing parallel site counts to the extreme while margins stay thin. SEMIROC breaks down how we delivered a design using roughly 20% fewer PCB layers than a comparable competitor approach, while holding signal/power integrity and mechanical reliability on a large-panel MAP test build.
July 22
2026
Case Study 4: Signal Integrity Design for 224Gbps mmWave Test
As test signal speeds push into the 224Gbps mmWave range, via impedance discontinuity becomes the primary source of insertion and return loss degradation. SEMIROC breaks down our 3D EM modeling, impedance control, and probe co-design capability for mmWave test scenarios.
July 14
2026
Case Study 3: Power Integrity Design for High-Density Multi-Site Parallel Test | SEMIROC
As AI and high-performance chip testing shifts toward higher parallel site counts to reduce per-unit test cost, power integrity (PI) — not signal integrity — is becoming the real design ceiling. SEMIROC breaks down our PI-driven design methodology and platform capability for high-density parallel test scenarios.
July 06
2026
Case Study 2: 50GHz High-Frequency & 54,000-Pin Extreme Density — Semiroc Overcomes Barriers in AI Mixed-Signal Chip Testing
Semiroc overcomes 50GHz signal integrity and 54,000-pin density challenges in AI mixed-signal chip testing with advanced PCB architecture and high-current contact stability.
May 07
2026
Case Study 1: Mastering Chiplet Probing: 120+ Site Parallel Testing
Discover how our 100+layer PCB and 120-site vertical probe card solution solves challenges in HPC & AI Chiplet testing on the Teradyne UF+ platform.
Apr 07
2026
5 Common Errors in Semiconductor Burn-in Board Design and How to Avoid Them
Five common errors in burn-in board design: material fatigue, insufficient PDN impedance, signal trace length matching, socket selection, and maintainability. Practical avoidance methods are provided to enhance BIB reliability and lifespan.
Mar 26
2026
2026 Advanced Packaging Test Trends: How CPO, HBM4, and Glass Substrates Reshape ATE Interface Hardware Semiroc
With advanced packaging market reaching $47.88B in 2026, CPO, HBM4 16-Hi stacking, and glass substrates drive custom ATE test interfaces. Learn about optoelectronic hybrid test, ultra-fine pitch probe cards, and liquid-cooled test solutions.
Mar 23
2026
ATE Load Board Selection Guide 2026 | Pin Count to Reliability
How to select the right ATE Load Board for Teradyne UltraFLEX, Advantest V93000? Learn about pin count, signal integrity, power integrity, thermal management, and supplier evaluation. Achieve a higher first-pass yield.
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