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In the dynamic realm of ATE interface hardware, our focus lies a commitment to continuous evolution in design, coupled with strategic collaborations with industry-leading upstream partners. This synergistic approach not only ensures the seamless integration of innovative technologies into our products but also positions us at the forefront of the ever-evolving tech landscape, driving us to deliver solutions that not only meet but exceed the demands of a rapidly advancing industry.

Apr 07

2026

5 Common Errors in Semiconductor Burn-in Board Design and How to Avoid Them

Five common errors in burn-in board design: material fatigue, insufficient PDN impedance, signal trace length matching, socket selection, and maintainability. Practical avoidance methods are provided to enhance BIB reliability and lifespan.
Green IC burn-in test board with 16 chip sockets, labeled for semiconductor reliability testing in a lab.
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Mar 26

2026

2026 Advanced Packaging Test Trends: How CPO, HBM4, and Glass Substrates Reshape ATE Interface Hardware Semiroc

With advanced packaging market reaching $47.88B in 2026, CPO, HBM4 16-Hi stacking, and glass substrates drive custom ATE test interfaces. Learn about optoelectronic hybrid test, ultra-fine pitch probe cards, and liquid-cooled test solutions.
Advanced microchip architecture with labeled components, showcasing high-density connectors, liquid cooling, glass substrate.
High-precision MEMS probe station setup with labeled components for RF signal testing on PCB.
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Mar 23

2026

ATE Load Board Selection Guide 2026 | Pin Count to Reliability

How to select the right ATE Load Board for Teradyne UltraFLEX, Advantest V93000? Learn about pin count, signal integrity, power integrity, thermal management, and supplier evaluation. Achieve a higher first-pass yield.
Close-up of a blue circuit board with an open CPU socket, showcasing intricate gold traces and electronic components.
Four graphs showing voltage vs. time with colored waveforms, illustrating signal patterns across different scales.
Infographic showing five key dimensions of supplier evaluation: technical manufacturing quality delivery value-added services
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Nov 23

2023

A Quantum Leap in Manufacturing: Our Strategic Partner Achieves Breakthroughs in MLO(multi-layer-organics) Capabilities

According to the official WeChat account of Western Chongqing Science City, recently, the IDM industry base project of Oson Semiconductor's 8-inch MEMS characteristic chip has settled in the Western (Chongqing) Science City, with Guangzhou Oson Electronics Co., Ltd. as the investment entity.
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Address: Room 505, Building A8, No.2555 Xiupu Road, Pudong New Area, Shanghai
Contact Number: 8621-58185886
Email: sales@semiroc.com
https://www.semiroc.com
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Omron
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Semiroc
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Omron
沪ICP备2024051690号
Privacy Policy
|
Terms of Use
All rights of Shanghai Laiao Electronic Technology Co., Ltd.